Samsung DDR3 Instrukcja Użytkownika Pobierz pdf (Strona 10)

General Information

DDR3 SDRAM

4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product)

240Pin DDR3 VLP Registered DIMM

Org. Density Part Number Speed Raw Card Composition

Comp.

Version

Internal

Banks

Rank PKG Height Avail. Note

128Mx 72 1GB

M392B2873EH1 YF8/H9

K(1Rx8)

128M x 8 * 9 pcs 1Gb E-die

8 1

78 ball

18.75mm Now

M392B2873FH0 YF8/H9 128M x 8 * 9 pcs 1Gb F-die

FBGA

M392B5673EH1 YF8/H9

L(2Rx8)

128M x 8 * 18 pcs 1Gb E-die

8 2

M392B5673FH0 YF8/H9 128M x 8 * 18 pcs 1Gb F-die

78 ball

FBGA

256Mx 72 2GB M392B5670EH1 YF8/H9

M(1Rx4)

256M x 4 * 18 pcs 1Gb E-die 18.75mm Now

M392B5670FH0 YF8/H9 256M x 4 * 18 pcs 1Gb F-die 8 1

M392B5773CH0 YF8/H9 K(1Rx8) 512M x 4 * 9 pcs 2Gb C-die

M392B5170EM1 YF8/H9 N(2Rx4)

DDP

512M

x 4 * 18 pcs 1Gb E-die 8 2 Now

M392B5173FM0 YF7/F8 V(4Rx8) 256M x 8 * 18 pcs 1Gb F-die 8 4

Dec. ’09

512Mx 72 4GB

M392B5170FM0 YF8/H9 N(2Rx4) 512M x 4 * 18 pcs 1Gb F-die

78 ball

18.75mm

M392B5273BH1 YF8/H9

L(2Rx8)

256M x 8 * 18 pcs 2Gb B-die 8 2

FBGA

M392B5273CH0 YF8/H9 256M x 8 * 18 pcs 2Gb C-die

Now

M392B5270BH1 YF8/H9

M(1Rx4)

512M x 4 * 18 pcs 2Gb B-die

8 1

M392B5270CH0 YF8/H9 512M x 4 * 18 pcs 2Gb C-die

M392B1K73BM1 YF7/F8

V(4Rx8)

DDP

512M

x 8 * 18 pcs 2Gb B-die

8 4

Now

1Gx 72 8GB

M392B1K73CM0 YF7/F8

DDP

512M

x 8 * 18 pcs 2Gb C-die

78 ball

18.75mm

Nov. ’09

M392B1K70BM1 YF8/H9

N(2Rx4)

DDP

x 4 * 18 pcs 2Gb B-die

8 2

FBGA

Now

M392B1K70CM0 YF8/H9

DDP

x 4 * 18 pcs 2Gb C-die Nov. ’09

Note : 1.35V product is 1.5V operatable.

ELECTRONICS

October 2009

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