Samsung MMCRE28G5MXP-0VB00 Arkusz Danych Pobierz pdf (Strona 28)

JANUARY 2009

www.samsung.com/semi/fusion

FusionMemory

OneDRAM

OneDRAM is a dual-port, low-power DRAM with an SRAM buffer interface and is optimal for high-performance, high-density mobile applications.

Density Part Number Package Org. Voltage

(V)

Temp. Speed MOQ

(Tray)

Remarks

512Mb

KJA51Z23PC-AAO

216FBGA

(14x14)

A-port:x16(SDR/DDR)

B-port:x16(SDR/DDR)

1.8V extended 133MHz

PKG Combination: 2G OneNAND + 512Mb MDDR + 512MB

OneDRAM

MCP P/N: KAC00F00JM

KJA51Y23PC-AAO

152FBGA

(14x14)

A-port:x16(SDR/DDR)

B-port:x16(SDR/DDR)

1.8V extended 133MHz

PKG Combination: 2G NAND + 512Mb MDDR + 512Mb

OneDRAM

MCP P/N: KAR00900GM

OneNAND

OneNAND is a monolothic IC that combines a NAND flash array with a NOR flash interface plus an SRAM buffer. It’s ideal for high-performance, high-density applications.

Density Part Number Package Org. Voltage (V) Temp. Speed MOQ (Tray) Remarks

512Mb

KFG1216Q2B-DEB8000 63FBGA (9.5x12) X16 1.8 extended 83Mhz 1,120

KFG1216U2B-DIB6000 63FBGA (9.5x12) X16 3.3 industrial 66Mhz 1,120

KFG1216Q2B-SEB8000 67FBGA (7x9) X16 1.8 extended 83Mhz 1,120

KFG1216U2B-SIB6000 67FBGA (7x9) X16 3.3 industrial 66Mhz 1,120

KFM1216Q2B-DEB8000 63 FBGA (9.5x12) X16 1.8v extended 83Mhz 1,120 Muxed

1Gb

KFG1G16U2C-AIB6000 63 FBGA (10x13) X16 3.3v industrial 66Mhz 1,120

KFG1G16Q2C-AEB8000 63 FBGA (10x13) X16 1.8v extended 83Mhz 1,120

KFM1G16Q2C-DEB8000 63 FBGA (10x13) X16 1.8v extended 83Mhz 1,120 Muxed

2Gb

KFG2G16Q2A-DEB8000 63 FBGA (10x13) X16 1.8v extended 83Mhz 1,120

KFM2G16Q2A-DEB8000 63 FBGA (10x13) X16 1.8v extended 83Mhz 1,120 Muxed

4Gb DDP KFH4G16Q2A-DEB8000 63 FBGA (10x13) X16 1.8v extended 83Mhz 1,120

*T&R MOQ 2Kpcs

**Please contact your local Samsung sales representative for latest product offerings & information on support & availability.

NOTE: All parts are lead free

Flex-OneNAND

A monolithic IC with a NAND flash array using a NOR flash interface, Flex-OneNAND enables partitioning into SLC and MLC areas so the chip can be configured for storage or high-speed access.

Density Part Number Package Org. Voltage (V) Temp. Speed MOQ (Tray) Remarks

4Gb Flex-OneNAND

KFG4GH6Q4M-DEB8000 63 FBGA (10x13) X16 1.8v extended 83Mhz 1,120 FSR software required

KFG4GH6U4M-DIB6000 63 FBGA (10x13) X16 3.3V Industrial 66Mhz 1,120 FSR software required

KFM4GH6Q4M-DEB8000 63 FBGA (10x13) X16 1.8v extended 83Mhz 1,120 Muxed. FSR SW req.

8Gb DDP Flex-OneNAND KFH8GH6U4M-DIB6000 63 FBGA (10x13) X16 3.3V Industrial 66Mhz 1,120 FSR software required

*T&R MOQ 2Kpcs

**Please contact your local Samsung sales representative for latest product offerings & information on support & availability.

NOTE: All parts are lead free

moviNAND

Combining high-density MLC NAND flash with an MMC controller in a single chip that has an MMC interface, moviNAND delivers dense, cost-effective storage for embedded applications.

moviNAND Densities Vol(V) Package Package Size Org.

1GB 1.8/3.3 FBGA 12.0x18x1.2t x8

2GB 1.8/3.3 FBGA 12.0x18x1.2t x8

4GB 1.8/3.3 FBGA 12.0x18x1.2t x8

8GB 1.8/3.3 FBGA 12.0x18x1.3t x8

16GB 1.8/3.3 FBGA 14.0x18.0 x8

Please contact your local Samsung sales representative for latest product offerings.

NOTE: All parts are lead free